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Repair bond strength of dual-cured resin composite core buildup materials

机译:修复双固化树脂复合芯堆积材料的粘结强度

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The reparability of dual-cured resin composite core buildup materials using a light-cured one following one week or three months storage, prior to repair was evaluated. Two different dual-cured resin composites; Cosmecore(TM) DC automix and Clearfil(TM) DC automix core buildup materials and a light-cured nanofilled resin composite; Filtek(TM) Z350 XT were used. Substrate specimens were prepared (n=12/each substrate material) and stored in artificial saliva at 37^oC either for one week or three months. Afterward, all specimens were ground flat, etched using Scotchbond(TM) phosphoric acid etchant and received Single Bond Universal adhesive system according to the manufacturers' instructions. The light-cured nanofilled resin composite (Filtek(TM) Z350 XT) was used as a repair material buildup. To determine the cohesive strength of each solid substrate material, additional specimens from each core material (n=12) were prepared and stored for the same periods. Five sticks (0.8+/-0.01mm^2) were obtained from each specimen (30 sticks/group) for microtensile bond strength (@mTBS) testing. Modes of failure were also determined. Two-way ANOVA revealed a significant effect for the core materials but not for the storage periods or their interaction. After one week, dual-cured resin composite core buildup materials (Cosmecore(TM) DC and Clearfil(TM) DC) achieved significantly higher repair @mTBS than the light-cured nanofilled resin composite (Filtek(TM) Z350 XT). However, Clearfil(TM) DC revealed the highest value, then Cosmecore(TM) DC and Filtek(TM) Z350 XT, following storage for 3-month. Repair strength values recovered 64-86% of the cohesive strengths of solid substrate materials. The predominant mode of failure was the mixed type. Dual-cured resin composite core buildup materials revealed acceptable repair bond strength values even after 3-month storage.
机译:评估了在修复前一周或三个月内使用一种光固化的树脂对双固化树脂复合材料核心堆积材料的可修复性。两种不同的双固化树脂复合材料; Cosmecore(TM)DC自动混合和Clearfil(TM)DC自动混合堆芯材料以及光固化的纳米填充树脂复合材料;使用了Filtek TM Z350 XT。准备底物标本(n = 12 /每种底物材料),并在37℃的人工唾液中保存1周或3个月。之后,将所有样品磨平,使用Scotchbond TM磷酸蚀刻剂进行蚀刻,并根据制造商的说明使用Single Bond Universal胶粘剂系统。将光固化的纳米填充树脂复合材料(Filtek™Z350 XT)用作修补材料。为了确定每种固体基材的内聚强度,需要准备每种芯材的其他样品(n = 12),并保存相同的时间。从每个样品(30支/组)中获得五支(0.8 +/- 0.01mm ^ 2)用于微拉伸粘合强度(@mTBS)测试。还确定了故障模式。双向方差分析显示对核心材料有显着影响,但对储存期或它们之间的相互作用没有影响。一周后,双固化树脂复合材料核心堆积材料(Cosmecore™DC和Clearfil™DC)比光固化纳米填充树脂复合材料(Filtek™Z350 XT)实现了更高的@mTBS修复。然而,在存放三个月后,Clearfil TM DC显示出最高值,然后是Cosmecore TM DC和Filtek TM Z350 XT。修复强度值恢复了固体基材的内聚强度的64-86%。失败的主要模式是混合类型。双固化树脂复合材料核心堆积材料即使在储存三个月后仍显示出可接受的修复粘结强度值。

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