EFFECT OF USING ELECTRIC CURRENT DURING DENTIN BONDING AGENT APPLICATION ON MICROLEAKAGE UNDER SIMULATED PULPAL PRESSURE CONDITION

摘要

Background: The use of electric current during application of etch-and-rinse adhesive systems has been recently introduced to decrease microleakage. This study investigated the effects of an electric field produced by an experimental device for the application of a two-step etch-and-rinse adhesive on moist dentin surface.Methods: Sixty freshly extracted human premolars were used for this study. In order to simulate real conditions, the pulpal pressure was set to 35 cm H₂O for all the specimens. The teeth were divided into two groups: in group I, etch-and-rinse system (Single Bond) was applied with electric current while group II, etch-and-rinse system (Single Bond) was applied without electric current. Specimens were prepared for dye penetration test. The data were analyzed using Mann-Whitney U test.Results: The results showed that group I had less microleakage scores compared to group II (P=0.047).Conclusion: Based on the result of this study, it could be concluded that using electric current for applying adhesive systems had a significant effect on reducing microleakage.