Electroless Ni-P deposition over polyvinylidene fluoride thin films with wet acid treatment

摘要

PolyvinylideneFluoride(PVDF)isaveryversatilepolymerwithenoughpotentialtoprovideagreatdevelopmentinmaterialsscienceandtechnology,duetoitspiezoelectricity,lowenergysurface,lowcost,flexibility,mechanicalandchemicalresistances.Forelectricalapplications,likepiezoelectricsensorsandactuators,forexample,PVDFsurfacemetallizationisessential.Thispaperdescribesanalternativemetallizationmethod,calledelectrolessnickel-phosphorusdeposition(Ni-P),inPVDFfilmsdepositedonglasssubstratewithsomegeometricstructuresfabricatedbyPhotolithography.Afterawetpre-treatmenttoimproveadherence,electrolesscontactlayerisdepositedoverPVDFmaskedbyphotolithography,usingthelift-offtechnique.Thisprocesscombinationisveryversatile,simpleandgivesgoodresults,relatedtotheNi-PadhesiononPVDFsurfaceandtothepatternresolutionofphotolithographicstructures.ChemicalcompositionofthealloyedfilmweremeasuredbySEM/EDS(ScanningElectronMicroscopy-EnergyDispersiveX-RaySpectroscopy),thePVDFsurfacetreatmentwasexaminedusingInfraredSpectroscopyandtheresolutionofNi-PdepositionevaluatedbytheScanningElectronMicroscope.ThisworkopensapossibilityofanewmetallizationtechniqueforPVDFpiezoelectricdevices.