...
首页> 外文期刊>Science and Engineering of Composite Materials >Fabrication, mechanical, thermal, and electrical characterization of epoxy/silica composites for high-voltage insulation
【24h】

Fabrication, mechanical, thermal, and electrical characterization of epoxy/silica composites for high-voltage insulation

机译:用于高压绝缘的环氧/二氧化硅复合材料的制造,机械,热和电学特性

获取原文
           

摘要

For improved performance of epoxy, its composites were studied for high-voltage insulation. Epoxy composites may offer several advantages over neat epoxy and ceramic materials. We fabricated nano- and microepoxy/silica composites with 5 wt% nanosilica and 20 wt% microsilica, respectively. The composites and neat epoxy were studied for thermal, mechanical, and electrical properties. A thermogravimetric analyzer was used for analyzing wt% loss with temperature. Tensile and hardness tests were performed according to DIN 53504/ASTM D412 and DIN 53505/ASTM D2240 standards, respectively. Electrical properties such as dielectric strength and resistivity were tested according to IEC-60243-1 and ASTM D257/IEC 60093 standards, respectively. Neat epoxy, microcomposite, and nanocomposite showed 50% weight loss at 392°C, 410°C, and 421°C, respectively. At 550°C, nanocomposite remained at 20% of its initial weight whereas neat epoxy and microcomposite remained at 10% of their initial weights. Microcomposite and nanocomposite showed tensile strengths of 65.7 Mpa and 69.3 Mpa, respectively. Enhancements of 8% and 19% in dielectric strength were recorded for microcomposites and nanocomposites, respectively. Nanosilica greatly improved surface and volume resistivity whereas microsilica showed negligible effect on resistivity.
机译:为了提高环氧树脂的性能,对其复合材料进行了高压绝缘研究。环氧复合材料可能比纯环氧和陶瓷材料具有多个优势。我们制造了分别具有5 wt%的纳米二氧化硅和20 wt%的微二氧化硅的纳米和微环氧/二氧化硅复合材料。研究了复合材料和纯环氧树脂的热,机械和电性能。使用热重分析仪分析随温度的wt%损失。分别根据DIN 53504 / ASTM D412和DIN 53505 / ASTM D2240标准进行拉伸和硬度测试。分别根据IEC-60243-1和ASTM D257 / IEC 60093标准测试了介电强度和电阻率等电性能。干净的环氧树脂,微复合材料和纳米复合材料分别在392°C,410°C和421°C时失重50%。在550℃下,纳米复合材料保持其初始重量的20%,而纯净的环氧树脂和微复合材料保持其初始重量的10%。微复合材料和纳米复合材料的抗张强度分别为65.7 Mpa和69.3 Mpa。分别记录了微复合材料和纳米复合材料的介电强度分别提高了8%和19%。纳米二氧化硅极大地改善了表面和体积电阻率,而微二氧化硅对电阻率的影响可忽略不计。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号