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Molecular engineered conjugated polymer with high thermal conductivity

机译:具有高导热性的分子工程共轭聚合物

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Traditional polymers are both electrically and thermally insulating. The development of electrically conductive polymers has led to novel applications such as flexible displays, solar cells, and wearable biosensors. As in the case of electrically conductive polymers, the development of polymers with high thermal conductivity would open up a range of applications in next-generation electronic, optoelectronic, and energy devices. Current research has so far been limited to engineering polymers either by strong intramolecular interactions, which enable efficient phonon transport along the polymer chains, or by strong intermolecular interactions, which enable efficient phonon transport between the polymer chains. However, it has not been possible until now to engineer both interactions simultaneously. We report the first realization of high thermal conductivity in the thin film of a conjugated polymer, poly(3-hexylthiophene), via bottom-up oxidative chemical vapor deposition (oCVD), taking advantage of both strong C=C covalent bonding along the extended polymer chain and strong π-π stacking noncovalent interactions between chains. We confirm the presence of both types of interactions by systematic structural characterization, achieving a near–room temperature thermal conductivity of 2.2 W/m·K, which is 10 times higher than that of conventional polymers. With the solvent-free oCVD technique, it is now possible to grow polymer films conformally on a variety of substrates as lightweight, flexible heat conductors that are also electrically insulating and resistant to corrosion.
机译:传统聚合物既电绝缘又热绝缘。导电聚合物的发展导致了新的应用,例如柔性显示器,太阳能电池和可穿戴生物传感器。就像导电聚合物一样,具有高导热性的聚合物的开发将在下一代电子,光电和能源设备中打开一系列应用。迄今为止,目前的研究仅限于通过强分子内相互作用(其能够沿聚合物链有效地进行声子传输)或通过强分子间相互作用(其能够在聚合物链之间进行有效的声子传输)来工程化聚合物。但是,到目前为止,不可能同时设计两个交互。我们报告了通过自下而上的氧化化学气相沉积(oCVD)在共轭聚合物,聚(3-己基噻吩)薄膜中首次实现高热导率的方法,同时利用了沿延伸方向的强C = C共价键聚合物链和链之间强烈的π-π堆积非共价相互作用。我们通过系统的结构表征确认了两种类型相互作用的存在,实现了近室温下2.2 W / m·K的导热系数,这是传统聚合物的10倍。借助无溶剂的oCVD技术,现在可以在各种基材上共形地生长聚合物薄膜,从而使它们既轻便又柔软,同时具有电绝缘性和耐腐蚀性能。

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