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Effect of the Carbon C60, C70 Contents on the Dielectric Properties of Polyimide Films

机译:碳C 60 ,C 70 的含量对聚酰亚胺薄膜介电性能的影响

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The paper presents results of dielectric measurements of polyimide films with C60 and C70 fullerenes added in various ratios. Changes of capacitance and dielectric losses were measured in frequency range 102-106 Hz, at the temperature of 300K. Relaxation analysis was based on Havriliak-Negami equation. Influence of type and amount of fullerene in samples on dielectric properties was observed. Even its minimal amount (0,05%) increases capacitance from 10 to 20% - depending on type of fullerene. Dielectric losses coefficient is decreasing while C60 and C70 carbon contents is increasing. Approximation of dielectric spectra with Havriliak-Negami equation allowed to estimate changes of time constants of β-relaxation process. Modification of polyimid with carbon C70-type has no significant influence on time constants, while increasing amount of carbon C60-type leads to shorter β-relaxation times.
机译:本文介绍了以不同比例添加C 60 和C 70 富勒烯的聚酰亚胺薄膜的介电测量结果。在300K温度下,在10 2 -10 6 Hz频率范围内测量电容和介电损耗的变化。弛豫分析基于Havriliak-Negami方程。观察到样品中富勒烯的类型和数量对介电性能的影响。根据富勒烯的类型,即使最小量(0.05%)也会使电容从10%增加到20%。随着C 60 和C 70 碳含量的增加,介电损耗系数减小。用Havriliak-Negami方程近似介电谱可以估算β弛豫过程的时间常数的变化。 C 70 型碳修饰聚酰亚胺对时间常数的影响不大,而C 60 型碳的增加量导致β-松弛时间缩短。

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