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A New Type of Fbg Sensor with High Temperature Sensitivity

机译:一种新型的高灵敏度Fbg传感器

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摘要

A method of using polymer to encapsulate the bare FBG is proposed and implemented. The principle of the increasing in sensitivity of FBG is introduced, a novel packaging material composed of 100 wt% unsaturated polyester, 2 wt% Methyl Ethyl Ketone Peroxide and 2 wt% cobalt naphthenate is realized. With the help of casting a model, FBG is encapsulated. After establishing the experimental platform, the temperature sensitivity of the packaged FBG is also analyzed. The comparison of the experimental results between the packaged FBG and the bare FBG shows that over the temperature of 24-44oC, the equivalent temperature sensitivity of the packaged FBG is 0.10387 nm/°C, which can be increased by about 14.268 times as much as that of bare FBG and close to the theoretical values 0.108 nm/°C. The FBG package material and technique is effective in the increasing of the temperature sensitivity, which is suitable for applications where wavelength references for FBG sensor system with high temperature sensitivity is required, especially in the measurement of human body temperature.
机译:提出并实现了一种使用聚合物封装裸露的FBG的方法。介绍了提高FBG灵敏度的原理,实现了一种新型包装材料,该包装材料由100%(重量)的不饱和聚酯,2%(重量)的甲乙酮过氧化物和2%(重量)的环烷酸钴组成。在铸造模型的帮助下,FBG被封装。建立实验平台后,还分析了已包装FBG的温度敏感性。封装的FBG和裸露的FBG的实验结果比较表明,在24-44oC的温度下,封装的FBG的等效温度灵敏度为0.10387 nm /°C,可以提高约14.268倍。裸FBG的热导率,接近理论值0.108 nm /°C。 FBG封装材料和技术可有效提高温度敏感性,适用于需要具有高温敏感性的FBG传感器系统的波长参考的应用,尤其是在人体温度测量中。

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