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Determination of Modulus of Elasticity, Nanohardness and Residual Stresses in Brush-plated Gold and Silver Coatings on Copper Substrate

机译:铜基板上刷涂金和银涂层的弹性模量,纳米硬度和残余应力的测定

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In the current study the investigated brush-plated gold coatings are generally used for repairing the commutators of generators and sliding contacts made in most cases of copper. Considering the cost, gold is sometimes replaced by silver in manufacturing electronic components. Nickel-hardened gold and silver coatings were brush plated from a commercial SIFCO Dalic Solution (Gold Hard Alloy), Code SPS 5370, and Silver Hard Heavy Build, Code SPS 3080, on unclosed thin-walled copper ring substrates. The magnitudes of the modulus of elasticity and of nanohardness of the coatings were obtained by instrumented indentation using the MTS Nano Indenter XR? and the Micromaterials Nano Test system pendulum-type nanohardness tester. Residual stresses in the coatings were calculated from the curvature changes of the substrates and they represented tensile stresses. Relaxation of residual stresses was observed. An equation for approximation of the change of residual stresses was applied assuming that the dependence of residual stresses on relaxation time is linear-fractional. The values of residual stresses in the gold and silver coatings decreased considerably, during the first weeks in particular. The equation for approximation of the change of residual stresses allows to predict the finishing residual stresses in the coating for the exploitation period within the limits of measurement uncertainty. The surface morphology and microstructure of the coatings was studied by means of scanning electron microscopy (SEM).
机译:在当前的研究中,所研究的刷镀金涂层通常用于修理发电机的换向器和大多数情况下由铜制成的滑动触点。考虑到成本,在制造电子元件时,有时金会被银代替。在未封闭的薄壁铜环基板上,用商品代码为SPS 5370的SIFCO达利奇解决方案(黄金硬质合金)和商品代码为SPS 3080的银质硬质涂层,刷涂镍硬化的金和银涂层。涂层的弹性模量和纳米硬度的大小是通过使用MTS Nano Indenter XR?微材料纳米测试系统摆式纳米硬度测试仪。由基材的曲率变化计算出涂层中的残余应力,它们表示拉伸应力。观察到残余应力的松弛。假设残余应力对松弛时间的依赖性为线性分数,则应用近似残余应力变化的方程。特别是在最初的几周内,金和银涂层的残余应力值大大降低。残余应力变化的近似方程式可以在测量不确定性的范围内,预测在开发阶段涂层最终的残余应力。通过扫描电子显微镜(SEM)研究了涂层的表面形貌和微观结构。

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