Tin-doped indium oxide (ITO) tablets were used to deposit ITO films on p-GaN layer of light-emitting diodes. Needles and cracks in ITO tablets generated during electron beam evaporation process were deeply investigated. The formation of needles is predominantly resulted from the scanning trace, which is controlled by x and y axes scanning singles. The needles can be eliminated by controlling electron beam scanning trace. The loose microstructure with uniform grains and pores in the ITO tablets results in weak bonding strength, which leads to cracks under the thermal shock of high energy electron beam. A three-dimensional reticulated skeleton structure with strong bonding strength can restrain these cracks.
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