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A New Vertical JFET Power Device for Harsh Radiation Environments

机译:适用于恶劣辐射环境的新型垂直JFET功率器件

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An increasing demand for power electronic devices able to be operative in harsh radiation environments is now taking place. Specifically, in High Energy Physics experiments the required power devices are expected to withstand very high radiation levels which are normally too hard for most of the available commercial solutions. In this context, a new vertical junction field effect transistor (JFET) has been designed and fabricated at the Instituto de Microelectrónica de Barcelona, Centro Nacional de Microelectrónica (IMB-CNM, CSIC). The new silicon V-JFET devices draw upon a deep-trenched technology to achieve volume conduction and low switch-off voltage, together with a moderately high voltage capability. The first batches of V-JFET prototypes have been already fabricated at the IMB-CNM clean room, and several aspects of their design, fabrication and the outcome of their characterization are summarized and discussed in this paper. Radiation hardness of the fabricated transistors have been tested both with gamma and neutron irradiations, and the results are also included in the contribution.
机译:现在,对能够在恶劣的辐射环境中运行的电力电子设备的需求日益增长。具体而言,在高能物理实验中,所需的功率设备有望承受很高的辐射水平,这对于大多数可用的商业解决方案而言通常太难了。在这种情况下,已经在国家微电子中心的巴塞罗那微电子研究所(IMB-CNM,CSIC)设计并制造了一种新型的垂直结场效应晶体管(JFET)。新型硅V-JFET器件采用了深沟技术,可实现体积导通和低关断电压,并具有适度的高电压能力。第一批V-JFET原型已经在IMB-CNM洁净室中制造,本文对它们的设计,制造以及其表征结果进行了总结和讨论。所制造的晶体管的辐射硬度已通过伽马和中子辐照进行了测试,结果也包括在贡献中。

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