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ELECTROCHEMICAL MODIFICATION OF GRAPHITE SURFACE

机译:石墨表面的电化学修饰

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Thermodynamic and electrochemical parameters of intercalation and deintercalation of hydrosulfate ions into the graphite substrate have been investigated using electrodes after preliminary intercalation and without this stage and involving methods of the cyclic voltammetry, electronic microscopy and general principles of the irreversible thermodynamics. Potentials of the intercalation and deintercalation starting points, potentials of the anodic and cathodic maximums have been determined and changes in the free Gibbs energy for the intercalation and deintercalation processes, changes in the enthalpy and enthropy of these processes, diffusion and migration fluxes of the hydrosulfate ions were calculated using the experimental data. Criteria of Schtakelberg, Tomesh and Shevchik and measurements of an amount of electricity required for the processes were used to evaluate the reversibility ratio of intercalation and deintercalation. It was found that raise in the intercalation-deintercalation cycles number results in increase in the limit anodic current value. This increase may be caused by partial decomposition of the graphite substrate structure and faster intercalation of the hydrosulfate ions during next cycles. Evaluation of the diffusion and migration fluxes of hydrosulfate ions has been made using an electronic microscopy. Thermodynamic moving forces of the fluxes have been analyzed. The higher is the concentration of sulfuric acid, the higher is the surface concentration of sulfur. A value of the flux of the electrochemical intercalation of hydrosulfate ions from a 1 M solution of sulfuric acid is about 42 times higher comparing to the physical intercalation flux value. A contribution of the latter flux into the total intercalation flux is only 3.8 % from the electrochemical intercalation flux contribution.
机译:已在初步插入之后且没有该阶段的情况下,使用电极研究了将硫酸氢根离子嵌入和脱嵌到石墨基质中的热力学和电化学参数,涉及循环伏安法,电子显微镜和不可逆热力学的一般原理。确定了嵌入和脱嵌起点的电位,阳极和阴极最大值的电位,以及用于嵌入和脱嵌过程的自由吉布斯能的变化,这些过程的焓和焓的变化,氢硫酸盐的扩散和迁移通量使用实验数据计算离子。使用Schtakelberg,Tomesh和Shevchik的标准以及该过程所需电量的测量值来评估插层和脱插层的可逆比。已经发现,插入-脱嵌循环数的增加导致极限阳极电流值的增加。这种增加可能是由于石墨基材结构的部分分解以及下一个循环中氢硫酸根离子的更快嵌入所致。已使用电子显微镜对氢硫酸根离子的扩散和迁移通量进行了评估。分析了助熔剂的热力学移动力。硫酸的浓度越高,硫的表面浓度越高。从1M硫酸溶液中硫酸氢根离子的电化学插层的通量值与物理插层通量值相比大约高42倍。从电化学插层通量的贡献来看,后一种通量对总插层通量的贡献仅为3.8%。

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