Effect of Electrodeposition Parameters on the Morphology of Three-Dimensional Porous Copper Foams

摘要

Copper films with different open interconnected porous structures were gained by using hydrogenbubbles as dynamic template at different electrodeposition conditions (deposition current density anddeposition temperature). The influences of electrodepositing parameters on the micro-morphology andgrain size were investigated. The experimental results showed that the morphology of copper foamschanged from distributed sparse dendrites to honeycomb-like structure with increasing the depositioncurrent density, further increased the current density could lead to the grain refinement and latticeparameter reduction. Relatively lower temperature could contribute to the formation of three- dimensionally ordered porous structures and the stability of the lattice regularity. At room temperature,the porous network was observed on the surface of the Cu substrate, while it is difficult to formordered morphology at higher bath temperature (0. Meanwhile, the grain size and lattice constantincreased obviously with increasing the deposition temperature, implying the existence oflattice distortion for high temperature deposition.