Effect of Molecular Weight of Polyethylene Glycol on Copper Electrodeposition in the Presence of Bis-3-Sulfopropyl-Disulfide

摘要

This study examined the effect of polyethylene glycol (PEG) with different molecular weights on thecopper electrodeposition in acid copper sulfate plating solution containing bis-3-sulfopropyl-disulfide(SPS) and chloride ion. Quantum chemical study, cyclic voltammetry, and surface analyses (HP-thinfilm XRD, FE-SEM) were conducted to evaluate the adsorption nature, crystallographiccharacteristics, and surface morphology. In copper electrodeposition, the adsorption effect of PEG isdependent on its molecular weight regardless of the existence of SPS. The increase of suppressioneffect with high PEG molecular weight induced the SPS biasing action which causes the change ofsurface property such as roughness, glossiness, preferred plane and grain size. In addition, PEGactivated SPS reactions.