Surface Morphology and Electrical Properties of Pulse Electrodeposition of NiFe Films on Copper Substrates in Ultrasonic Field

摘要

NiFe films were pulse electrodeposited on conductive copper substrates under galvanostatic mode withand without the presence of an ultrasonic field at different pulse current magnitudes and duty cycles.The optimum deposition condition was found to be at a current magnitude of 40 mA and a duty cycleof 50.00% under ultrasonic treatment. This deposition condition has significantly reduced the surfaceroughness from 39.01 .1 nm to 6.96 1.1 nm and the spherical grain size in the range from 579.40nm 623.30 nm to 29.00 nm 46.90 nm. On the other hand, the resistivity was reduced to 19.86m from 54.00 m as the Ni content increased from 76.08% to 80.12 % for achieving goodstoichiometry for NiFe thin films. Through the optimization study, the deposition current is observedto be the dominant factor in determining the single phase deposition of NiFe film whereas ultrasonicfield and duty cycle significantly reduces the surface roughness and the spherical grain size, all ofwhich combine to reduce film resistivity.