High heat flux removal are important issue in many perspective applications such as computer chips, laser diode arrays, or boilers working on supercritical parameters. Electronic microchips constructed nowadays are model example of high heat flux removal, where the cooling system have to maintain the temperature below 358 K and take heat flux up to 300 W/cm2. One of the most efficient methods of microchips cooling turns out to be the spray cooling method. Review of installations has been accomplished for removal at high heat flux with liquid sprays. In the article are shown high flux removal characteristic and dependences, boiling critical parameters, as also the numerical method of spray cooling analysis.
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机译：在许多透视应用中，例如计算机芯片，激光二极管阵列或工作于超临界参数的锅炉，高热通量去除是重要的问题。如今构造的电子微芯片是去除高热通量的典范示例，其中的冷却系统必须将温度保持在358 K以下，并使热通量达到300 W / cm2。芯片冷却的最有效方法之一是喷雾冷却方法。已经完成了使用液体喷雾以高热通量去除设备的审查。文章中显示了高通量去除特性和依赖性，沸腾关键参数，以及喷雾冷却分析的数值方法。
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