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A Comparative Study of Additively Manufactured Thin Wall and Block Structure with Al-6.3%Cu Alloy Using Cold Metal Transfer Process

机译:Al-6.3%Cu合金冷金属转移工艺增材制造薄壁及块体结构的比较研究

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In order to build a better understanding of the relationship between depositing mode and porosity, microstructure, and properties in wire + arc additive manufacturing (WAAM) 2319-Al components, several Al-6.3%Cu deposits were produced by WAAM technique with cold metal transfer (CMT) variants, pulsed CMT (CMT-P) and advanced CMT (CMT-ADV). Thin walls and blocks were selected as the depositing paths to make WAAM samples. Porosity, microstructure and micro hardness of these WAAM samples were investigated. Compared with CMT-P and thin wall mode, CMT-ADV and block process can effectively reduce the pores in WAAM aluminum alloy. The microstructure varied with different depositing paths and CMT variants. The micro hardness value of thin wall samples was around 75 HV from the bottom to the middle, and gradually decreased toward the top. Meanwhile, the micro hardness value ranged around 72–77 HV, and varied periodically in block samples. The variation in micro hardness is consistent with standard microstructure characteristics.
机译:为了更好地理解金属丝+电弧增材制造(WAAM)2319-Al组件中沉积方式与孔隙率,微观结构和性能之间的关系,通过WAAM技术通过冷金属转移生产了若干Al-6.3%Cu沉积物(CMT)变体,脉冲CMT(CMT-P)和高级CMT(CMT-ADV)。选择薄壁和砌块作为WAAM样品的沉积路径。研究了这些WAAM样品的孔隙率,微观结构和显微硬度。与CMT-P和薄壁模式相比,CMT-ADV和阻塞工艺可以有效减少WAAM铝合金中的气孔。微观结构随沉积路径和CMT变体的不同而变化。薄壁样品的显微硬度值从底部到中间大约为75 HV,并向顶部逐渐降低。同时,显微硬度值在72-77 HV范围内,并在块状样品中周期性变化。显微硬度的变化与标准显微组织特征一致。

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