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Highly (200)-Preferred Orientation TiN Thin Films Grown by DC Reactive Magnetron Sputtering

机译:直流反应磁控溅射生长的(200)择优取向TiN薄膜

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Titanium nitride (TiN_x) thin films were prepared on Si(111) substrates by DC reactive magnetron sputtering. The influence of chamber pressure on the lattice constants, grain size, surface morphologies, conductivity and visible-near infrared reflectance of TiN_x thin films were investigated. It is shown that the main component of the thin films is cubic TiN with (200) preferred orientation. The resistivity of the TiN thin film increase along with the increase of the chamber pressure, whereas the lattice constants and average reflectance within near infrared range of the TiN thin film decrease gradually. For all the TiN films, there is a minimum reflectance around 455nm.
机译:通过直流反应磁控溅射在Si(111)衬底上制备了氮化钛(TiN_x)薄膜。研究了腔室压力对TiN_x薄膜晶格常数,晶粒尺寸,表面形貌,电导率和可见近红外反射率的影响。结果表明,薄膜的主要成分是立方氮化钛,其取向优选为(200)。 TiN薄膜的电阻率随腔室压力的增加而增加,而TiN薄膜在近红外范围内的晶格常数和平均反射率逐渐降低。对于所有的TiN薄膜,最小反射率约为455nm。

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