Effects of plasma pretreatment on the process of self-forming Cu–Mn alloy barriers for Cu interconnects

摘要

This study investigated the effect of plasma pretreatment on the process of a self-forming Cu–Mn alloy barrier on porous low-k dielectrics. To study the effects of plasma on the performance of a self-formed Mn-based barrier, low-k dielectrics were pretreated with H₂ plasma or NH₃ plasma. Cu–Mn alloy materials on low-k substrates that were subject to pretreatment with H₂ plasma exhibited lower electrical resistivity values and the formation of thicker Mn-based interlayers than those on low-k substrates that were subject to pretreatment with NH₃ plasma. Transmission electron microscopy (TEM), X-ray photoemission spectroscopy (XPS), and thermal stability analyses demonstrated the exceptional performance of the Mn-based interlayer on plasma-pretreated low-k substrates with regard to thickness, chemical composition, and reliability. Plasma treating with H₂ gas formed hydrophilic Si–OH bonds on the surface of the low-k layer, resulting in Mn-based interlayers with greater thickness after annealing. However, additional moisture uptake was induced on the surface of the low-k dielectric, degrading electrical reliability. By contrast, plasma treating with NH₃ gas was less effective with regard to forming a Mn-based interlayer, but produced a Si–N/C–N layer on the low-k surface, yielding improved barrier characteristics.