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Valley current characterization of high current density resonant tunnelling diodes for terahertz-wave applications

机译:太赫兹波应用中高电流密度谐振隧穿二极管的谷值电流表征

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We report valley current characterisation of high current density InGaAs/AlAs/InP resonant tunnelling diodes (RTDs) grown by metal-organic vapour phase epitaxy (MOVPE) for THz emission, with a view to investigate the origin of the valley current and optimize device performance. By applying a dual-pass fabrication technique, we are able to measure the RTD I-V characteristic for different perimeter/area ratios, which uniquely allows us to investigate the contribution of leakage current to the valley current and its effect on the PVCR from a single device. Temperature dependent (20 – 300 K) characteristics for a device are critically analysed and the effect of temperature on the maximum extractable power (PMAX) and the negative differential conductance (NDC) of the device is investigated. By performing theoretical modelling, we are able to explore the effect of typical variations in structural composition during the growth process on the tunnelling properties of the device, and hence the device performance.
机译:我们报告了由金属有机气相外延(MOVPE)产生的高电流密度InGaAs / AlAs / InP共振隧穿二极管(RTD)的THz发射的谷值电流表征,以研究谷值电流的起源并优化器件性能。通过采用双通道制造技术,我们能够测量不同周长/面积比的RTD IV特性,这使我们能够唯一地研究泄漏电流对谷值电流的贡献及其对单个设备对PVCR的影响。 。严格分析了器件的温度相关(20 – 300 K)特性,并研究了温度对器件最大可提取功率(P MAX )和负电导(NDC)的影响。通过执行理论建模,我们能够探索生长过程中结构组成的典型变化对器件的隧穿性能以及器件性能的影响。

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