首页> 外文期刊>Advances in materials science and engineering >Correlation of Grain Size, Stacking Fault Energy, and Texture in Cu-Al Alloys Deformed under Simulated Rolling Conditions
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Correlation of Grain Size, Stacking Fault Energy, and Texture in Cu-Al Alloys Deformed under Simulated Rolling Conditions

机译:模拟轧制条件下变形的Cu-Al合金晶粒尺寸,堆垛层错能和织构的相关性

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The effect of grain size and stacking fault energy (SFE) on the strain hardening rate behavior under plane strain compression (PSC) is investigated for pure Cu and binary Cu-Al alloys containing 1, 2, 4.7, and 7 wt. % Al. The alloys studied have a wide range of SFE from a low SFE of 4.5 mJm−2for Cu-7Al to a medium SFE of 78 mJm−2for pure Cu. A series of PSC tests have been conducted on these alloys for three average grain sizes of ~15, 70, and 250 μm. Strain hardening rate curves were obtained and a criterion relating twinning stress to grain size is established. It is concluded that the stress required for twinning initiation decreases with increasing grain size. Low values of SFE have an indirect influence on twinning stress by increasing the strain hardening rate which is reflected in building up the critical dislocation density needed to initiate mechanical twinning. A study on the effect of grain size on the intensity of the brass texture component for the low SFE alloys has revealed the reduction of the orientation density of that component with increasing grain size.
机译:研究了纯铜和含1、2、4.7和7 wt。%的纯Cu和二元Cu-Al合金的晶粒尺寸和堆垛层错能(SFE)对平面应变压缩(PSC)下的应变硬化速率行为的影响。铝含量研究的合金具有广泛的SFE,从Cu-7Al的4.5 SmJm-2的低SFE到纯Cu的78 SmJm-2的中SFE。在这些合金上进行了一系列的PSC测试,得出三种平均晶粒尺寸分别为〜15、70和250μm。获得了应变硬化速率曲线,并建立了将孪晶应力与晶粒尺寸相关的判据。结论是,孪晶引发所需的应力随着晶粒尺寸的增加而降低。较低的SFE值会通过增加应变硬化速率而间接影响孪晶应力,这反映在累积引发机械孪晶所需的临界位错密度上。对低SFE合金的晶粒尺寸对黄铜织构成分强度的影响的研究表明,该成分的取向密度随晶粒尺寸的增加而降低。

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