Stress-Induced Stacking Faults in alpha Cu-Al Alloys

摘要

A study has been made to determine the mechanisms by which stress-induced stacking faults are generated in alpha-Cu-Al alloys. The overshoot phenomenon observed in single crystal tensile tests has been studied in order to elucidate the influence of stress-induced stacking faults upon this phenomenon. Observations have also been made of the thermal annihilation of stacking faults and of solute segregation into stacking faults. Finally, the effect of stress-induced stacking faults upon the transcrystalline stress corrosion failure has been studied. Conventional metallographic methods, such as optical microscopy, hardness measurements and X-ray diffraction have been used, but the primary research tool has been transmission electron microscopy. (Author)