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Characteristics of a Silicon Wafer and after Planting Nitrogen

机译:硅晶片和种植氮后的特性

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In this paper, different steps of work and experiments that are done in order to implant nitrogen ion in silicon with the energy of 25 keV, density of 24 μA/cm2 and doses of 5 × 1013 atom/cm2, 1?× 1014 atom/cm2 and 1?× 1015 atom/ cm2 (according to the calculation and applying time at planting) at room temperature (in the lack of heat phase) and without annealing will be presented. The XRD analysis is done before and after planting to observe changes in the lattice and the possibility of forming a crystalline phase of silicon nitride in this case. Also, the study of changes in the lattice arrangement and AFM analysis is done to observe the topography of the surface. Besides, the investigation on surface roughness and changes caused by ion implantation on the surface and spectrophotometry analysis before and after planting due to the study of changes in optical properties are done.
机译:在本文中,为了以25 keV的能量,24μA/ cm2的密度和5×1013原子/ cm2的剂量,1?×1014原子/将介绍在室温(缺少热相)且未进行退火的情况下,每平方厘米2和1?×1015原子/平方厘米(根据种植时的计算和施用时间)。 XRD分析在种植前后进行,以观察晶格的变化以及在这种情况下形成氮化硅结晶相的可能性。此外,还进行了晶格排列变化的研究和AFM分析,以观察表面的形貌。此外,由于光学性能的变化,对表面粗糙度和离子注入表面引起的变化进行了研究,并在分光光度法下进行了种植前后的分析。

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