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Deposition of High Conductivity Low Silver Content Materials by Screen Printing

机译:通过丝网印刷沉积高电导率低银含量的材料

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A comprehensive experimental investigation has been carried out into the role of film thickness variation and silver material formulation on printing capability in the screen printing process. A full factorial experiment was carried out where two formulations of silver materials were printed through a range of screens to a polyester substrate under a set of standard conditions. The materials represented a novel low silver content (45%–49%) polymer material and traditional high silver content (65%–69%) paste. The resultant prints were characterised topologically and electrically. The study shows that more cost effective use of the silver in the ink was obtained with the low silver polymer materials, but that the electrical performance was more strongly affected by the mesh being used (and hence film thickness). Thus, while optimum silver use could be obtained using materials with a lower silver content, this came with the consequence of reduced process robustness.
机译:已经进行了全面的实验研究,研究了膜厚变化和银材料配方对丝网印刷过程中印刷能力的作用。进行了完全析因实验,其中在一系列标准条件下,通过一系列的丝网将两种配方的银材料印刷到聚酯基材上。这些材料代表了一种新颖的低银含量(45%–49%)聚合物材料和传统的高银含量(65%–69%)浆料。所得印刷品通过拓扑和电学表征。研究表明,使用低银聚合物材料可以更经济地使用墨水中的银,但是所使用的网眼(以及因此的薄膜厚度)对电性能的影响更大。因此,尽管使用较低银含量的材料可以获得最佳的银使用量,但其结果是降低了工艺的坚固性。

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