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Effect of bonding material, etching time and silane on the bond strength of metallic orthodontic brackets to ceramic

机译:粘接材料,蚀刻时间和硅烷对金属正畸托槽与陶瓷粘接强度的影响

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The purpose of this study was to evaluate the bond strength of metallic orthodontic brackets to feldspathic ceramic with different etching times, bonding materials and with or without silane application. Cylinders of feldspathic ceramic were etched with 10% hydrofluoric acid for 20 or 60 s. For each etching time, half of the cylinders received two layers of silane. Metallic brackets were bonded to the cylinders using Transbond XT (3M Unitek) or Fuji Ortho LC (GC). Light-activation was carried out with total exposure time of 40 s using UltraLume 5. Shear bond strength testing was performed after 24 h storage. Data were submitted to three-way ANOVA and Tukey's test (α=0.05). The adhesive remnant index (ARI) was used to evaluate the amount of adhesive remaining on the ceramic surface at ×8 magnification. Specimens etched for 60 s had significantly higher bond strength compared with 20 s. The application of silane was efficient in increasing the shear bond strength between ceramic and both fixed materials. Transbond XT showed significantly higher (p
机译:这项研究的目的是评估在不同蚀刻时间,粘结材料以及有无硅烷的情况下金属正畸托槽与长石瓷的粘结强度。用10%氢氟酸腐蚀长石陶瓷圆柱体20或60 s。对于每个蚀刻时间,一半的圆柱体接受两层硅烷。使用Transbond XT(3M Unitek)或Fuji Ortho LC(GC)将金属托架粘结到圆柱上。使用UltraLume 5在总曝光时间为40 s的条件下进行光激活。储存24小时后进行剪切粘结强度测试。将数据提交给三项方差分析和Tukey检验(α= 0.05)。粘合剂残留指数(ARI)用于评估在×8放大倍率下残留在陶瓷表面上的粘合剂量。蚀刻60 s的标本与20 s相比具有更高的结合强度。硅烷的应用有效地提高了陶瓷与两种固定材料之间的剪切粘结强度。 Transbond XT显着更高(p

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