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首页> 外文期刊>Brazilian Dental Journal >Influence of alloy microstructure on the microshear bond strength of basic alloys to a resin luting cement
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Influence of alloy microstructure on the microshear bond strength of basic alloys to a resin luting cement

机译:合金微观结构对基础合金与树脂胶泥的微剪切粘结强度的影响

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The aim of this study was to evaluate the influence of microstructure and composition of basic alloys on their microshear bond strength (μSBS) to resin luting cement. The alloys used were: Supreme Cast-V (SC), Tilite Star (TS), Wiron 99 (W9), VeraBond II (VBII), VeraBond (VB), Remanium (RM) and IPS d.SIGN 30 (IPS). Five wax patterns (13mm in diameter and 4mm height) were invested, and cast in a centrifugal casting machine for each basic alloy. The specimens were embedded in resin, polished with a SiC paper and sandblasted. After cleaning the metal surfaces, six tygon tubes (0.5 mm height and 0.75 mm in diameter) were placed on each alloy surface, the resin cement (Panavia F) was inserted, and the excess was removed before light-curing. After storage (24 h/37°C), the specimens were subjected to μSBS testing (0.5 mm/min). The data were subjected to a one-way repeated measures analysis of variance and Turkey's test (α=0.05). After polishing, their microstructures were revealed with specific conditioners. The highest μSBS (mean/standard deviation in MPa) were observed in the alloys with dendritic structure, eutectic formation or precipitation: VB (30.6/1.7), TS (29.8/0.9), SC (30.6/1.7), with the exception of IPS (31.1/0.9) which showed high μSBS but no eutectic formation. The W9 (28.1/1.5), VBII (25.9/2.0) and RM (25.9/0.9) showed the lowest μSBS and no eutectic formation. It seems that alloys with eutectic formation provide the highest μSBS values when bonded to a light-cured resin luting cement.
机译:这项研究的目的是评估基础合金的微观结构和组成对其对树脂胶结水泥的微剪切粘合强度(μSBS)的影响。使用的合金为:Supreme Cast-V(SC),Tilite Star(TS),Wiron 99(W9),VeraBond II(VBII),VeraBond(VB),Remanium(RM)和IPS d.SIGN 30(IPS)。投资了五个蜡模(直径13mm,高度4mm),并在离心铸造机中铸造每种基础合金。将样品嵌入树脂中,用SiC纸抛光并喷砂。清洁金属表面后,在每个合金表面上放置6个tygon管(高度为0.5 mm,直径为0.75 mm),插入树脂水泥(Panavia F),并在光固化前除去多余的部分。储存(24 h / 37°C)后,对样品进行μSBS测试(0.5 mm / min)。对数据进行方差和土耳其检验(α= 0.05)的单向重复测量分析。抛光后,用特定的调理剂显示其微结构。在具有树枝状结构,共晶形成或沉淀的合金中观察到最高的μSBS(均值/标准偏差,以MPa为单位):VB(30.6 / 1.7),TS(29.8 / 0.9),SC(30.6 / 1.7),但IPS(31.1 / 0.9)显示较高的SBS,但无共晶形成。 W9(28.1 / 1.5),VBII(25.9 / 2.0)和RM(25.9 / 0.9)显示最低的μSBS,无共晶形成。当与光固化的树脂浸胶水泥粘合时,具有共晶形成的合金似乎提供最高的μSBS值。

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