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TLK1B promotes repair of DSBs via its interaction with Rad9 and Asf1

机译:TLK1B通过与Rad9和Asf1的相互作用促进DSB的修复。

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Background The Tousled-like kinases are involved in chromatin assembly, DNA repair, transcription, and chromosome segregation. Previous evidence indicated that TLK1B can promote repair of plasmids with cohesive ends in vitro, but it was inferred that the mechanism was indirect and via chromatin assembly, mediated by its interaction with the chromatin assembly factor Asf1. We recently identified Rad9 as a substrate of TLK1B, and we presented evidence that the TLK1B-Rad9 interaction plays some role in DSB repair. Hence the relative contribution of Asf1 and Rad9 to the protective effect of TLK1B in DSBs repair is not known. Using an adeno-HO-mediated cleavage system in MM3MG cells, we previously showed that overexpression of either TLK1B or a kinase-dead protein (KD) promoted repair and the assembly of Rad9 in proximity of the DSB at early time points post-infection. This established that it is a chaperone activity of TLK1B and not directly the kinase activity that promotes recruitment of 9-1-1 to the DSB. However, the phosphorylation of Rad9(S328) by TLK1B appeared important for mediating a cell cycle checkpoint, and thus, this phosphorylation of Rad9 may have other effects on 9-1-1 functionality. Results Here we present direct evidence that TLK1B can promote repair of linearized plasmids with incompatible ends that require processing prior to ligation. Immunodepletion of Rad9 indicated that Rad9 was important for processing the ends preceding ligation, suggesting that the interaction of TLK1B with Rad9 is a key mediator for this type of repair. Ligation of incompatible ends also required DNA-PK, as addition of wortmannin or immunodepletion of Ku70 abrogated ligation. Depletion of Ku70 prevented the ligation of the plasmid but did not affect stimulation of the fill-in of the ends by added TLK1B, which was attributed to Rad9. From experiments with the HO-cleavage system, we now show that Rad17, a subunit of the "clamp loader", associates normally with the DSB in KD-overexpressing cells. However, the subsequent release of Rad17 and Rad9 upon repair of the DSB was significantly slower in these cells compared to controls or cells expressing wt-TLK1B. Conclusions TLKs play important roles in DNA repair, not only by modulation of chromatin assembly via Asf1, but also by a more direct function in processing the ends of a DSB via interaction with Rad9. Inhibition of Rad9 phosphorylation in KD-overexpressing cells may have consequences in signaling completion of the repair and cell cycle re-entry, and could explain a loss of viability from DSBs in these cells.
机译:背景技术Tousled样激酶参与染色质组装,DNA修复,转录和染色体分离。先前的证据表明,TLK1B可以在体外促进具有粘性末端的质粒的修复,但可以推断该机制是间接的,并且是通过其与染色质组装因子Asf1相互作用介导的,通过染色质组装。我们最近确定Rad9为TLK1B的底物,并且我们提供了TLK1B-Rad9相互作用在DSB修复中起作用的证据。因此尚不清楚Asf1和Rad9对TLK1B在DSB修复中的保护作用的相对贡献。使用MM3MG细胞中的腺HO介导的裂解系统,我们以前表明TLK1B或激酶死亡蛋白(KD)的过表达促进了感染后在早期DSB附近修复和Rad9的组装。这确定了它是TLK1B的伴侣活性,而不是直接促进9-1-1募集到DSB的激酶活性。但是,TLK1B对Rad9(S328)的磷酸化对于介导细胞周期检查点显得很重要,因此Rad9的这种磷酸化可能对9-1-1的功能产生其他影响。结果在这里,我们提供了直接的证据,即TLK1B可以促进末端不兼容的线性化质粒的修复,该末端需要在连接之前进行处理。 Rad9的免疫缺陷化表明Rad9对于处理连接前的末端很重要,这表明TLK1B与Rad9的相互作用是这种修复的关键介体。不相容末端的连接也需要DNA-PK,因为加入渥曼青霉素或免疫耗竭的Ku70取消了连接。 Ku70的消耗阻止了质粒的连接,但不影响添加的归因于Rad9的TLK1B对末端填充的刺激。从HO裂解系统的实验中,我们现在显示Rad17,“钳式装载器”的一个亚基,通常与过表达KD的细胞中的DSB缔合。但是,与对照或表达wt-TLK1B的细胞相比,这些细胞在修复DSB时随后释放Rad17和Rad9的速度明显降低。结论TLK在DNA修复中起着重要作用,不仅通过通过Asf1调节染色质装配,而且通过与Rad9相互作用在处理DSB末端时起更直接的作用。在过表达KD的细胞中抑制Rad9磷酸化可能会影响修复和细胞周期重入信号的完成,并可能解释了这些细胞中DSB的活力丧失。

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