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机译:低对称电感SiC多芯片功率模块的设计与评估
Chongqing University, People's Republic of China;
Chongqing University, People's Republic of China;
Chongqing University, People's Republic of China;
Chongqing University, People's Republic of China;
School of Engineering, University of Warwick, UK;
multichip modules; electromagnetic interference; silicon compounds; power semiconductor devices; wide band gap semiconductors; power MOSFET; finite element analysis;
机译:寄生电感建模和减少线粘合半桥SIC MultiChip电源模块
机译:具有开尔文漏极连接和低寄生电感的SiC功率模块封装设计在电气性能方面的进步
机译:PowerSynth设计自动化流程,用于等级和异构2.5-D MultiChip电源模块
机译:集成式分流器的无连接器SiC电源模块-薄型设计,可实现低电感和低成本
机译:利用先进的层压板,碳化硅和类金刚石碳技术对半桥多芯片电源模块(MCPM)进行设计,制造和分析。
机译:1200V / 200A全SiC电源模块在开启瞬态时上侧和下侧开关的vgs特性的建模和分析
机译:用于多芯片SiC电源模块电热分析的物理RC网络模型