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Using Adaptive Circuits to Mitigate Process Variations in a Microprocessor Design

机译:在微处理器设计中使用自适应电路缓解工艺变化

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摘要

This case study discusses how to use adaptive circuits in a big dual-core microprocessor to combat process variation. The large die size also makes it suffer more on-die process variation. To prevent continuous design updates or multiple design optimizations, designs incorporate adaptive techniques that achieve the highest performance possible. Although adaptive techniques are not new, having been implemented to some degree for generations (for example, self-calibrating I/O), they have taken significant new roles in many design aspects. As adaptive designs proliferate, increasing amounts of effort go into testing them. This article presented two types of adaptive systems: the silicon-optimizing active deskew system and the silicon-monitoring power measurement and cache latent-error detection system. However, these adaptive circuits are the tip of a growing iceberg. As variability increasingly affects designs, designers will likely use more adaptive circuits to achieve the highest performance and reliability possible. New scaling issues, such as erratic bits, will make these adaptations even more necessary to the design's fundamental operation. With increasing use of adaptive circuits, designers will need to develop new test techniques to ensure high part quality and reliability
机译:本案例研究讨论了如何在大型双核微处理器中使用自适应电路来应对工艺变化。较大的管芯尺寸也使其遭受更多的管芯工艺变化。为了防止持续进行设计更新或进行多次设计优化,设计应采用自适应技术,以实现最高性能。尽管自适应技术不是新技术,已经在一定程度上实现了几代人(例如,自校准I / O),但它们在许多设计方面都扮演了重要的新角色。随着自适应设计的激增,对它们进行测试的工作量越来越大。本文介绍了两种类型的自适应系统:硅优化有源偏移校正系统以及硅监测功率测量和缓存潜在错误检测系统。但是,这些自适应电路是不断发展的冰山一角。随着可变性越来越影响设计,设计人员可能会使用更多的自适应电路来实现最高的性能和可靠性。新的缩放问题(例如不稳定的位)将使这些修改对于设计的基本操作变得更加必要。随着自适应电路使用的增加,设计人员将需要开发新的测试技术以确保较高的零件质量和可靠性。

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