We investigated the structure and composition of titanium carbide thin films deposited by the reactive magnetron sputter ion plating process as a function of deposition parame- ters. The films were sputtered onto unheated glass substrates by means of an unbalanced planar d.c. magnetron equipped with a titanium target using a mixture of argon and methane. The deposition parameters ranged from 0.05 Pa to 2Pa for total working gas pressure pT, from 10/100 to 60/100 (volume) for relative methane concentration in the work- ing gas mixture, from 45 mm to 85 mm for the substrate-to-target distance d_s-t and from -50V to -800V for the substrate bias Us.
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