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机译:选择性湿法刻蚀制备尖锐定向生长TaSi_2光纤阵列的制备,微结构表征和腐蚀行为
State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, PR China;
State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, PR China;
State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, PR China;
State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, PR China;
State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, PR China;
State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, PR China;
A. Electronic materials; B. SEM; C. Acid corrosion;
机译:用于制造钙钛矿微结构阵列的高精度,模板辅助,各向异性湿法蚀刻方法
机译:通过微接触印刷,湿法化学蚀刻和反应离子蚀刻在Si和SiOx上形成微结构阵列
机译:通过微接触印刷,湿法化学蚀刻和反应离子蚀刻在Si和SiOx上形成微结构阵列
机译:通过对(110)硅进行结晶湿法刻蚀制成的具有超锐利纳米刀片阵列的机械细胞裂解芯片
机译:高性能半导体器件的选择性湿法蚀刻和腐蚀工艺的基础研究。
机译:KOH溶液中Si的一步各向异性湿法腐蚀制备的两层微结构
机译:在KOH溶液中通过一步各向异性湿法蚀刻si制备双层微结构