Superior anti-corrosion performance on Cu substrate achieved by dense polypropylene coating with ultrahigh inhibition efficiency deposited via the environmental-friendly method

摘要

In this work, an environmental-friendly and one-step synthetic method are adopted for the protective coating for electronic devices. A polypropylene (PP-V) coating has been deposited on Cu substrate by plasma enhanced chemical vapor deposition (PECVD). Compared with the solvent-based methods, the PECVD method enables the transition from gaseous feedstock to solid coating, and the process does not involve polluting organic solvents. Moreover, the PP-V coating prepared by the PECVD method possesses an excellent protective effect, which is determined by the high denseness of the coating. PP-V coating delivers 99.96% ultra-high corrosion inhibition efficiency and can increase the low-frequency impedance modulus of the substrate by 3 orders of magnitude, while providing good protection after 24 h of saltwater immersion as well, which displays a good application prospect in the protection of electronic devices.