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Functionalization of flat Si surfaces with inorganic compounds—Towards molecular CMOS hybrid devices

机译:用无机化合物对平坦的硅表面进行功能化—走向分子CMOS混合器件

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摘要

Covalent modification of flat silicon surfaces is a key step in integrating CMOS technology and molecular electronics that may lead to novel hybrid microelectronic devices. While much of the research has been focused on the functionalization of Si by organic compounds, interest in the functionalization with metal-containing species has intensified in recent years because of the unique attributes of inorganic species including rich redox characteristics and high ground state spins. Described in this short review are (i) synthetic approaches to immobilize inorganic compounds; (ii) structural, spectroscopic and voltammetric techniques for characterization of molecular layers; and (iii) preliminary device fabrication.
机译:平坦硅表面的共价修饰是整合CMOS技术和分子电子学的关键步骤,这可能会导致新型的混合微电子器件。尽管许多研究都集中在有机化合物对Si的官能化上,但是近年来由于含无机物种的独特属性(包括丰富的氧化还原特性和高基态自旋),人们对含金属物种进行功能化的兴趣日益增强。这篇简短的综述描述了(i)固定无机化合物的合成方法; (ii)表征分子层的结构,光谱和伏安技术; (iii)初步的设备制造。

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