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Precursors as enablers of ALD technology: Contributions from University of Helsinki

机译:ALD技术的前身:赫尔辛基大学的贡献

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The review focuses on ALD precursors of selected elements such as alkaline earth (Mg, Ca, Sr, Ba), group 4 metals, bistnuth, silver, iridium, selenium, tellurium and antimony. These elements are needed in dif-ferent high tech applications but are challenging for ALD. Their precursor design needs careful balancing between volatility, thermal stability and reactivity—the key properties of ALD precursors. The extensive studies showed that cyclopentadienyl based precursors of alkaline earth metals are versatile ALD pre-cursors which react with both water and ozone forming oxide. Group 4 ALD chemistry has been studied very widely and many good precursors have been found for the oxide ALD. From a bunch of different compound types studied the most protnising ALD precursor for bismuth is Bi(OCMe2iPr)_3 which shows stable ALD process with water at 150-250℃. The success in depositing noble metal films by ALD can be attributed more to the reactant rather than the metal precursor. Ru, Pt, Ir, Rh and Os films can be deposited from various organometallic and metal organic precursors using O_2 as the other precursor. Typically temperatures above 225℃ are needed. Using O_3 as a reactant films can be deposited at lower temperatures. Noble metal oxides are obtained below approx. 200℃ and metallic films above that. By supplying both O_3 and H_ as consecutive pulses, noble metal films can be deposited well below 200℃ For silver phosphine stabilized carboxylato and ß-diketonato complexes are thermally stable enough enabling hydrogen plasma enhanced ALD of silver tnetal films. Alkylsilyl compounds of selenium and tellurium are versatile ALD precursors for metal selenide and telluride films when combined with metal chloride precursors. The use of alkylsilyl compounds is not limited to group 16 elements but can also been used for group 15.
机译:本文重点介绍了选定元素的ALD前驱物,例如碱土金属(Mg,Ca,Sr,Ba),第4组金属,铋,银,铱,硒,碲和锑。这些元素在不同的高科技应用中是必需的,但对于ALD却具有挑战性。他们的前驱物设计需要在挥发性,热稳定性和反应性(ALD前驱物的关键特性)之间谨慎权衡。广泛的研究表明,碱土金属的基于环戊二烯基的前体是通用的ALD前体,可与水和臭氧反应生成氧化物。已经对第4组ALD化学进行了广泛的研究,并发现了许多用于氧化物ALD的良好前体。从一堆不同的化合物类型中研究出来的铋的最有优势的ALD前驱体是Bi(OCMe2iPr)_3,它在150-250℃的水中显示出稳定的ALD过程。通过ALD沉积贵金属膜的成功更多地归因于反应物而不是金属前体。 Ru,Pt,Ir,Rh和Os膜可以使用O_2作为其他前体从各种有机金属和金属有机前体中沉积。通常需要高于225℃的温度。使用O_3作为反应物可以在较低温度下沉积薄膜。在低于约10℃下获得贵金属氧化物。 200℃以上的金属膜。通过同时提供O_3和H_作为连续脉冲,可以在低于200℃的温度下沉积贵金属薄膜。由于磷化银稳定的羧基和ß-二酮酮络合物具有足够的热稳定性,因此可以通过氢等离子体增强银薄膜的ALD。硒和碲的烷基甲硅烷基化合物与金属氯化物前驱体结合使用时,是用于金属硒化物和碲化物薄膜的多功能ALD前驱体。烷基甲硅烷基化合物的使用不限于第16族元素,也可以用于第15族。

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