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Run-to-run control and performance monitoring of overlay in semiconductor manufacturing

机译:半导体制造中的层到层控制和性能监控

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摘要

In the manufacture of semiconductor products, overlay is one of the most critical design specifications. Overlay is the position of a pattern relative to underlying layers, and overlay control largely determines the minimum feature size that may be incorporated into semiconductor device designs. Overlay control must be performed on a run-to-run basis, i.e. at the end of a run when product characteristics are available, because they cannot be directly measured during a run. In this research a process model and a run-to-run control scheme was developed for overlay control, based on linear model predictive control, and successfully implemented in a commercial facility. Performance monitoring of the closed-loop process was also carried out.
机译:在半导体产品的制造中,覆盖是最关键的设计规范之一。覆盖是图案相对于底层的位置,并且覆盖控制在很大程度上决定了可纳入半导体器件设计的最小特征尺寸。重叠控制必须在每次运行的基础上执行,即,在可获得产品特性的情况下,在运行结束时进行,因为在运行期间无法直接对其进行测量。在这项研究中,基于线性模型预测控制,开发了一种过程模型和运行至运行控制方案用于覆盖控制,并在商业设施中成功实现。还对闭环过程进行了性能监控。

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