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Test pattern generation for droop faults

机译:产生下垂故障的测试码型

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In nanometer ICs, when several transistors in physical proximity switch within the same clock cycle, a substantial power supply drop, known as droop, may occur because of concurrent load on a via of the power grid. Transistors may slow down because of lower supply voltage. Modelling of such timing faults, termed as droop faults, and their impact on the functionality and timing behaviour of the circuit are yet to be fully understood. In this study, a simple automatic test pattern generation (ATPG) based procedure for stuck-at faults has been adapted to test droop faults. For validation of the methodology in combinational circuits and full scan sequential circuits, a set of appropriate clusters of gates is selected to cover potential droop-prone regions in a circuit. Experimental results on ISCAS-85 and ISCAS-89 benchmark circuits reveal that a very high droop fault coverage can be obtained by applying a short sequence of test vectors.
机译:在纳米IC中,当物理接近开关中的多个晶体管在同一时钟周期内切换时,由于电网通孔上的并发负载,可能会发生大幅度的电源下降,称为下降。由于电源电压较低,晶体管可能会减慢速度。这种时序故障(称为下垂故障)的建模及其对电路功能和时序行为的影响尚待充分理解。在这项研究中,适用于卡住故障的基于自动测试模式生成(ATPG)的简单过程已适用于测试下垂故障。为了验证组合电路和全扫描顺序电路中的方法,选择一组适当的门簇以覆盖电路中潜在的易下垂区域。在ISCAS-85和ISCAS-89基准电路上的实验结果表明,通过应用较短的测试向量序列,可以获得非常高的下垂故障覆盖率。

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