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A level set method for topology optimization of heat conduction problem under multiple load cases

机译:多负荷情况下导热问题拓扑优化的水平集方法

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摘要

In this paper we present a numerical approach of topology optimization under multiple load cases for heat conduction problem. This framework is based on the theories of topological derivative and shape derivative for elliptic system. We employ level set model to implicitly represent geometric boundary of thermal conductive material. Introducing topological derivative will generate new topology in the design domain, which suppresses the dependence of initial topology guess to some extent. The shape optimization is obtained by combining shape derivative with level set method. The functional of quadratic temperature gradient is taken as the objective function in our analysis, which is subjected to the state equation of steady heat conduction and volume constrain. The shape of material domain is treated as the design variable and the final result is achieved by updating level set function gradually. We develop an effective numerical technique to implement the optimal design with multiple load cases for heat conduction problem. Numerical examples demonstrate that our proposed approach is effective and robust for topology optimization of heat conduction problem.
机译:在本文中,我们为热传导问题提供了一种在多种负载情况下进行拓扑优化的数值方法。该框架基于椭圆系统的拓扑导数和形状导数的理论。我们使用水平集模型隐式表示导热材料的几何边界。引入拓扑导数将在设计域中生成新的拓扑,从而在某种程度上抑制了初始拓扑猜测的依赖性。通过将形状导数与水平集方法相结合来获得形状优化。在我们的分析中,将二次温度梯度函数作为目标函数,并服从稳态热传导和体积约束的状态方程。将材料域的形状视为设计变量,并通过逐渐更新级别设置功能来获得最终结果。我们开发了一种有效的数值技术,可以在多种载荷情况下实现热传导问题的最优设计。数值算例表明,我们提出的方法对于热传导问题的拓扑优化是有效且鲁棒的。

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