首页> 外文期刊>Composites. B, Engineering >Fabrication of highly flexible electromagnetic interference shielding polyimide carbon black composite using hot-pressing method
【24h】

Fabrication of highly flexible electromagnetic interference shielding polyimide carbon black composite using hot-pressing method

机译:采用热压方法制备高度柔性电磁干扰屏蔽聚酰亚胺炭黑复合材料

获取原文
获取原文并翻译 | 示例
获取外文期刊封面目录资料

摘要

Traditionally, electromagnetic interference (EMI) shielding material has been occupied by metallic materials due to its high electric conductivity and EMI shielding effect. However, with rising demands from technology development for light-weight, highly durable, and easily moldable materials, metallic materials are gradually being substituted by polymer composite materials. Still, there are limitations on polymer composite as EMI shields: High ratio of fillers in composite achieves excellent EMI shielding effect but it severely compromises its mechanical behaviors. In many studies, they have failed to fabricate the high-ratio filler films with good mechanical durability, but here the initially fragile high-ratio film has been transformed to a flexible film by a very simple method: Hot-pressing. This approach not only solved the problems mentioned above but further provided a possible breakthrough point for composite study by solving threshold of the maximum loading of the fillers in polymer matrix. The stiff composite of polyimide sponge with exceeding carbon black loading became a highly flexible EMI SE film with doubled tensile strength and enhanced EMI SE. As a result, a new way of fabricating flexible EMI shielding polymer composite is demonstrated with great potential applications in aerospace and wireless communications.
机译:传统上,由于其高导电性和EMI屏蔽效果,金属材料占据了电磁干扰(EMI)屏蔽材料。然而,随着技术开发的需求上升,对轻质,高度耐用,易于成型材料,金属材料逐渐被聚合物复合材料取代。尽管如此,在聚合物复合材料中存在局限性,作为EMI屏蔽:复合材料中的填料的高比率实现了优异的EMI屏蔽效果,但它严重损害其机械行为。在许多研究中,它们未能用良好的机械耐久性制造高比率填充膜,但是在这里,最初脆弱的高比膜通过非常简单的方法转化为柔性薄膜:热压。这种方法不仅解决了上述问题,而且还提供了通过求解聚合物基质中填料的最大负载的阈值来进行复合研究的可能突出点。具有超过炭黑负载的聚酰亚胺海绵的刚性复合材料成为高度柔韧的EMI SE膜,具有加倍的拉伸强度和增强的EMI SE。结果,在航空航天和无线通信中具有巨大的潜在应用,证明了制造柔性EMI屏蔽聚合物复合材料的新方法。

著录项

  • 来源
    《Composites. B, Engineering》 |2021年第15期|109010.1-109010.10|共10页
  • 作者单位

    Yonsei Univ Dept Chem & Biomol Engn 262 Seongsan No Seoul 120749 South Korea;

    Yonsei Univ Dept Chem & Biomol Engn 262 Seongsan No Seoul 120749 South Korea;

    Yonsei Univ Dept Chem & Biomol Engn 262 Seongsan No Seoul 120749 South Korea;

    Yonsei Univ Dept Chem & Biomol Engn 262 Seongsan No Seoul 120749 South Korea;

    Yonsei Univ Dept Chem & Biomol Engn 262 Seongsan No Seoul 120749 South Korea|Korea Inst Sci & Technol KIST Inst Adv Composite Mat 92 Chudong Ro Jeonbuk 55324 South Korea;

    Yonsei Univ Dept Chem & Biomol Engn 262 Seongsan No Seoul 120749 South Korea;

    Yonsei Univ Dept Chem & Biomol Engn 262 Seongsan No Seoul 120749 South Korea;

    Korea Inst Sci & Technol KIST Inst Adv Composite Mat 92 Chudong Ro Jeonbuk 55324 South Korea;

    Prod & Engn Div Hankook Tire 1 Chungcheongnam Do South Korea;

    Yonsei Univ Dept Chem & Biomol Engn 262 Seongsan No Seoul 120749 South Korea;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Polyimide; Electromagnetic interference shielding; Thin films; Porous polymer;

    机译:聚酰亚胺;电磁干扰屏蔽;薄膜;多孔聚合物;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号