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Thermal vibration analysis of SMA hybrid composite double curved sandwich panels

机译:SMA杂交复合双弯曲三明治面板的热振动分析

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This work analyses the thermal vibration of a double curved sandwich panel (DCSP) with embedded pre-strained shape memory alloy (SMA) wires hybrid composite face sheets and soft core. The von Karman nonlinear displacement-strain relationships are here applied to handle large deflections due to a thermal loading. The equations of motion are derived by applying the Hamilton's principle and the first order shear deformation theory (FSDT) for the composite face sheets and core layer. This last one features the displacement field of the Frostig's second model here, used to model the DCSP. The material properties of the DCSP are assumed to be both temperature-dependent (TD) and/or temperature-independent (TI). The effect of the SMA wires is captured by adding a stress recovery within the formulation. This term is determined by using a one-dimensional Brinson's model in the constitutive equations of the SMA composite face sheets during the phase transformation of the pre-strained SMA wires. It is verified that SMAs can play a key role within DCSPs subjected to a thermal loading condition, whereby the proposed formulation is validated comparatively against the available literature. We also explore the sensitivity of the vibration response for a varying SMA activation temperature, volume fraction, and pre-strain, as well as for different curvature ratios, thickness ratios and different sequences in composite layers.
机译:该工作分析了双弯曲夹层面板(DCSP)的热振动,采用嵌入式预束形状记忆合金(SMA)电线杂交复合面板和软芯。 von Karman非线性位移 - 应变关系在此应用于处理由于热负荷引起的大偏转。通过将汉密尔顿的原理和第一阶剪切变形理论(FSDT)应用于复合面板和芯层来源的运动方程。最后一个具有FROSTIG的第二模型的位移场,用于模拟DCSP。假设DCSP的材料特性是温度相关的(TD)和/或温度无关(TI)。通过在配方中添加应力恢复来捕获SMA线的效果。该术语是通过在预束性SMA线的相变期间在SMA复合面板的本构体转换期间使用一维的Brinson的模型来确定。验证SMA可以在经受热负荷条件的DCSP内发挥关键作用,从而对可用文献进行比较验证所提出的配方。我们还探讨了不同SMA活化温度,体积分数和预菌株的振动响应的敏感性,以及用于复合层中的不同曲率比,厚度比和不同序列。

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