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Experimental Study of Uniaxial-Stress Effects on DC Characteristics of nMOSFETs

机译:单轴应力对nMOSFET直流特性的实验研究

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Stress-induced shifts of the direct current characteristics on n-type metal oxide semiconductor field effect transistors (nMOSFETs) were investigated experimentally. The stress sensitivities of nMOSFET characteristics were measured by the 4-point bending method, and the gate-length dependence of transconductance shifts caused by uniaxial stress was evaluated. As a result, it is shown that the gate-length dependence of transconductance shifts is attributed to parasitic resistance of the nMOSFETs. Also, this paper verified the electron-mobility model proposed in the previous study that includes stress effects in comparison with the experimental results. As a result, several improvements for the electron-mobility model are proposed in this paper. We describe the change of the conduction-band energy induced by the shear deformation of silicon. The shear deformation with a uniaxial stress along the $[110]$ direction of silicon should be considered in the change of the conduction-band energy.
机译:实验研究了在n型金属氧化物半导体场效应晶体管(nMOSFET)上直流特性的应力诱导位移。通过4点弯曲法测量nMOSFET特性的应力敏感性,并评估由单轴应力引起的跨导位移的栅极长度依赖性。结果表明,跨导移位的栅极长度依赖性取决于nMOSFET的寄生电阻。此外,本文还验证了先前研究中提出的电子迁移率模型,该模型包括应力效应和实验结果。因此,本文提出了对电子迁移率模型的一些改进。我们描述了由硅的剪切变形引起的导带能量的变化。在导带能量的变化中,应考虑沿硅的$ [110] $方向具有单轴应力的剪切变形。

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