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Topographical and Microstructural Effects of Laser Surface Texturing on Tin-Coated Copper Electrical Connectors Under Load Cycling

机译:负载循环下激光表面纹理对镀锡铜电连接器的表面形貌和微观结构影响

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摘要

Increasing demands on modern connector materials for automotive applications, driven by the trends in miniaturization and electrification, require higher operating temperatures and lower contact normal loads. These lead to increased wear, begging the need for upgraded connector materials. In order to improve the electrical and wear behavior of an existing surface finish, the use of direct laser interference patterning (DLIP) on tin-plated copper contacts is explored. The focus of this paper lies on the evolution of the electrical resistance between textured contacts and a probe with an inert coating under normal loading. The microstructural and topographical changes due to DLIP as well as indentation during the contact resistance measurement are investigated by white light interferometry, scanning electron microscopy, and focused ion beam. The patterns change the primary deformation mechanism of the connector surface, which facilitates the fracture of electrically insulating oxide layers. This in turn leads to a decreased contact resistance in the considered load range, compared to the nontextured samples.
机译:在小型化和电气化趋势的推动下,对用于汽车应用的现代连接器材料的需求不断增长,这就要求更高的工作温度和更低的接触法向载荷。这些导致磨损增加,从而要求升级连接器材料。为了改善现有表面光洁度的电气和磨损性能,探索了在镀锡铜触点上使用直接激光干涉图案(DLIP)的方法。本文的重点在于在正常负载下带纹理的触点和带有惰性涂层的探针之间的电阻变化。通过白光干涉法,扫描电子显微镜和聚焦离子束研究了由于DLIP引起的微观结构和形貌变化以及接触电阻测量过程中的压痕。图案改变了连接器表面的主要变形机制,这有助于电绝缘氧化物层的断裂。与无纹理的样品相比,这又导致在所考虑的负载范围内降低的接触电阻。

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