机译:大型3D互连可靠性分析的电热力学耦合模拟
Department of Electrical and Computer Engineering, Center for Computational Electromagnetics, University of Illinois at Urbana–Champaign, Urbana, IL, USA;
Department of Electrical and Computer Engineering, Center for Computational Electromagnetics, University of Illinois at Urbana–Champaign, Urbana, IL, USA;
Stress; Computational modeling; Mathematical model; Strain; Integrated circuit interconnections; Reliability; Thermal analysis;
机译:钙钛矿太阳能电池中热分布的COMSOL模拟:光-电-热3-D耦合分析
机译:热电-机械耦合分析对功率器件劣化的可靠性评估
机译:电磁脉冲作用下互连的大型瞬态电热联合仿真
机译:使用电气建模和仿真方法对复杂互连结构进行快速3-D热分析
机译:三维集成电路中微互连的热机械可靠性:建模和仿真。
机译:水热力学耦合损伤模型及其在APSE中损伤演化的数值模拟
机译:热,电,机械耦合机制,使用离散层运动学对智能板和梁进行初始屈曲分析