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机译:底部填充封装的倒装芯片发光二极管中填充剂颗粒诱导的光吸收
Hong Kong Univ Sci & Technol, Ctr Adv Microsyst Packaging, Hong Kong, Peoples R China|HKUST LED FPD Technol Res & Dev Ctr, Foshan 528200, Peoples R China;
Hong Kong Univ Sci & Technol, Ctr Adv Microsyst Packaging, Hong Kong, Peoples R China;
Hong Kong Univ Sci & Technol, Ctr Adv Microsyst Packaging, Hong Kong, Peoples R China|HKUST LED FPD Technol Res & Dev Ctr, Foshan 528200, Peoples R China|Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Hong Kong, Peoples R China;
Chip scale packaging; electronic equipment manufacture; electronics packaging; flip-chip devices; semiconductor device manufacture;
机译:填充封装的倒装芯片发光二极管中的填充粒子诱导的光吸收
机译:网格状p型接触结构对深紫外倒装芯片发光二极管光提取效果的影响
机译:通过AL掺杂ITO透明导电电极的GaN的395nm倒装芯片发光二极管光提取增强
机译:自组装SiO_2微球阵列分析AlGaN基倒装芯片紫外发光二极管的光提取性能
机译:光学功能性表面,用于高光提取和控制氮化镓铟/氮化镓发光二极管的发光模式
机译:网格化p型接触结构对深紫外倒装芯片发光二极管光提取效果的影响
机译:倒装芯片基于紫外线发光二极管光提取效率的研究采用AlGAN Metasurface