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Deep submicron CMOS technology enables system-on-chip for wireless communications ICs

机译:深亚微米CMOS技术可实现无线通信IC的片上系统

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摘要

Deep submicron CMOS technologies enable sophisticated system-on-chip technologies, moving beyond traditional integration of digital functionality to include mixed-signal, RF, and power management capabilities. New levels of integration bring with them additional challenges that need to be addressed such as the cross-coupling of noise from digital switching circuits to sensitive analog/RF blocks, and the handling of high voltages by the PMU with decreasing maximum gate/drain-source voltages. This work describes SoC integration in local area wireless (e.g., Bluetooth) as well as in cellular applications (e.g., GSM).
机译:深亚微米CMOS技术支持复杂的片上系统技术,超越了传统的数字功能集成,包括混合信号,RF和电源管理功能。新的集成水平带来了其他需要解决的挑战,例如,数字开关电路与敏感的模拟/ RF模块之间的噪声交叉耦合,以及PMU在降低最大栅极/漏极-源极的情况下对高压的处理电压。这项工作描述了本地无线(例如蓝牙)和蜂窝应用(例如GSM)中的SoC集成。

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