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Maximal Delay Reduction for RLC-Based Multi-Source Multi-Sink Bus with Repeater Insertion

机译:具有中继器插入的基于RLC的多源多接收总线的最大延迟减少

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摘要

Signal propagation delay on a multi-source multi-sink bidirectional bus has a dominant effect on high-performance chips. This work presents a novel greedy algorithm that minimizes the critical propagation delay of an RLC-based bus. Based on the topology of a multi-source multi-sink bus and the RLC delay model, the proposed algorithm inserts signal repeaters into the critical path of the RLC-based bus and adjusts their sizes to minimize the maximal propagation delay. This procedure is repeated until no additional improvement is needed. Several buses with various topologies are tested using the proposed algorithm in deep submicron technologies. Experimentally, the critical delay in an RLC-based bus can be reduced dramatically by up to 62.4% with inserted repeater sizes of 24 and execution time of 1.65 s on average. Moreover, average delay reduction, repeater sizes, and running time for 0.18 μm technology are 5.8%, 6.4%, and 26.2%, respectively, better than those of 0.35 μm. Additionally, the topologies of all of the RLC-based buses with inserted repeaters in deep submicron technologies are simulated using HSPICE. The error ratio in the critical delay of a bus with inserted repeaters determined by comparison with HSPICE is 2.7% on average. The proposed algorithm is simple and extremely practical.
机译:多源多宿双向总线上的信号传播延迟对高性能芯片具有主要影响。这项工作提出了一种新颖的贪婪算法,该算法将基于RLC的总线的临界传播延迟最小化。基于多源多宿总线的拓扑和RLC延迟模型,该算法将信号中继器插入基于RLC的总线的关键路径中,并调整其大小以最大程度地减小最大传播延迟。重复此过程,直到不需要其他改进为止。使用提出的算法在深亚微米技术中测试了几种具有各种拓扑的总线。实验上,插入中继器的大小为24,执行时间平均为1.65 s,基于RLC的总线中的关键延迟可以显着降低高达62.4%。此外,0.18μm技术的平均延迟减少,转发器大小和运行时间分别为0.38μm,5.8%,6.4%和26.2%,优于0.35μm。此外,使用HSPICE对深亚微米技术中插入中继器的所有基于RLC的总线的拓扑进行了仿真。通过与HSPICE的比较确定的插入中继器的总线的关键延迟中的错误率平均为2.7%。该算法简单,实用。

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