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Hearing with bionic ears [cochlear implant devices]

机译:仿生耳朵的听力[人工耳蜗植入装置]

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摘要

According to speech perception-rate data continuous interleaved sampling (CIS) and spectral maxima sound processor (SMSP) techniques are, and probably will be, the best speech processing strategies for multichannel electrode cochlear implant devices. From packaging and power-consumption viewpoints, today's speech processing systems are very big and are, therefore, worn on the body and consume large electric power. Next-generation cochlear implant devices would be more compact, low-power products that would be worn behind or in the ear. It is clear that mixed-signal, high-density, and low-power design techniques are required to satisfy compactness, as well as low-power consumption features to realize intelligent speech sensation for the implantees. The especially critical design consideration of power supply lifetime and efficiency might be increased by using new promising technologies like microelectromechanical systems (MEMS)
机译:根据语音感知率数据,连续交织采样(CIS)和频谱最大声音处理器(SMSP)技术已经成为并且可能将成为多通道电极人工耳蜗植入设备的最佳语音处理策略。从包装和功耗的角度来看,当今的语音处理系统非常庞大,因此会戴在身上并消耗大量电能。下一代的人工耳蜗植入装置将是更紧凑的低功耗产品,可以戴在耳朵的后面或耳朵中。显然,需要混合信号,高密度和低功耗的设计技术来满足紧凑性以及低功耗特性的要求,以实现植入物的智能语音感知。通过使用微机电系统(MEMS)等新的有前途的技术,可以提高电源寿命和效率的特别关键的设计考虑因素

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