Imbedded Component/Die Technology

摘要

The U.S. Navy's Program Executive Office (PEO) Integrated Warfare Systems (IWS) 3A has authorized and funded a research and development contract for Soldering Technology International's (STI) patent-pending manufacturing technology, Imbedded Component/Die Technology (IC/DT). The technology for designing and manufacturing three-dimensional (3-D) circuit card assemblies (CCAs) addresses barriers in CCA design and fabrication, as well as the limitations in two-dimensional (2-D) printed circuit board (PCB) assembly. The drive to chip-scale packages and multichip modules (MCMs) has made real estate a premium on 2-D substrates. The push to smaller form and fit factors has driven the component industry down the size curve from 1208s to 0804/0603s and ultimately 0201/0101s. A smaller form and fit factor is paramount in gaining real estate for higher input/output (I/O) applications.