Plasma Processes FOR PRINTED CIRCUIT BOARD MANUFACTURING

摘要

Accelerating performance requirements are driving the demand for highspeed, multilayer PCBs. Traditional manufacturing methods for laminating these layered boards and removing residue from the vias are no longer effective. The use of radio frequency driven, low-pressure plasma provides an efficient, cost-effective and environmentally friendly method for surface treatment and cleaning of the boards. Specific applications of plasma technology to PCB manufacturing, critical parameters, and process examples will be discussed. Innovations in PCB material technology and the use of smaller geometries have led to an increased requirement for plasma processing at multiple steps in the manufacturing cycle. Multilayer PCBs with high-density interconnects require designs with finer pitch, smaller vias, and the use of new material technologies with high glass transition temperatures and low loss factors. While these materials solve coefficient of thermal expansion (CTE) and speed issues, difficulties arise during board manufacturing where the use of traditional processes is limited.