Elimination of Immersion Silver Plating Defects

摘要

The increasingly successful application of immersion silver as a final solderable finish for printed circuit boards (PCBs) has generated a considerable amount of performance data, at both the fabrication and assembly levels. A survey carried out over a 12-month period up to July 2005 was conducted among some of the leading Asia users of immersion silver plating technology. With the critical need for low ppm defect capability on advanced high-density interconnection (HDI) applications, this study focused on most prevalent reasons for failure or rejection of the silver finish. In particular, the study centered on its wider application in volume production situations from the standpoint of both the fabricator and the assembler.