Methods for achieving high speed acid copper electroplating in the PCB industry

摘要

Significant reductions in the cycle time for the desmear, " making holes conductive' and imaging stages of the printed circuit board manufacturing process have been achieved by the use of horizontal conveyorised techniques. If these savings in time are to be fully realised, it is also necessary to have a high-speed acid copper electroplating process that, by implication, must be capable of operating at very high current densities.