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Integrated inductors on liquid crystal polymer substrate for RF applications

机译:液晶聚合物基板上的集成电感器,用于射频应用

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Purpose - To investigate the fabrication of integrated inductors on a liquid crystal polymer (LCP) substrate. To analyze the RF performance of the integrated inductors. Design/methodology/approach - Fabrication of integrated inductors on a LCP substrate using an MCM-D/L technique. A lumped element model of the integrated inductors is proposed. An analytical approach is used to extract the parameters in the model. Findings - Integrated inductors on a LCP substrate have been fabricated using an MCM-D/L technique. The conductor loss of the thin microstrip lines is the major factor degrading the Q-value of the integrated inductors. A lumped element model of the integrated inductor is proposed. The parameters of the lumped element model can be extracted from the geometry of the integrated inductor. Further work will focus on increasing the conductor thickness from 500 nm to 5 μm. Originality/value - The value of the paper lies in its description of the integration of inductors on a LCP substrate. It also describes how to extract parameters of the lumped element model of the integrated inductors from the geometry.
机译:目的-研究在液晶聚合物(LCP)基板上集成电感器的制造。分析集成电感器的射频性能。设计/方法/方法-使用MCM-D / L技术在LCP基板上制造集成电感器。提出了集成电感的集总元件模型。使用一种分析方法来提取模型中的参数。发现-使用MCM-D / L技术在LCP基板上集成了电感器。细微带线的导体损耗是降低集成电感器Q值的主要因素。提出了集成电感的集总模型。集总元件模型的参数可以从集成电感器的几何形状中提取。进一步的工作将集中于将导体厚度从500 nm增加到5μm。原创性/价值-本文的价值在于其对LCP基板上电感器集成度的描述。它还描述了如何从几何图形中提取集成电感器集总元件模型的参数。

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